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Sr Member Eng Stf

Apply Now Job ID: 487487BR Date posted: Jul. 08, 2019 City: Moorestown State: New Jersey
Description:- Responsible for the mechanical design of Radar system equipment including requirements decomposition, concept design, detailed design and analysis, design documentation, procurement support, manufacturing support, test support, environmental testing of electronic packages e.g. T/R Modules, Analog Modules and LRUs .
- Responsible for microwave electronics packaging design of multi and/or single chip packages using chip and wire, flip chip and/or other high density interconnect methods. Design of substrates using ceramic and/or laminate materials. Design of internal package interconnect methods and NHA interconnect methods. Knowledgeable of commercially available manufacturing assembly techniques and ruggedization methods for military applications.
- Responsible for developing RF electronic packaging including TR Modules (chip and wire assemblies), RF Beamformers (L to Ku Band) and RF substrates with HTCC, LTCC, thick film, soft substrates, and fusion bonding. Responsible for developing Power and Logic electronic packages including PWB/CCAs, modules and LRUs.
- Responsible for thermal and stress finite analysis of chips, packages, modules and LRUs described above. Reliability analysis of electronics described above, including thermal analysis (package to chip junction level, steady state and transient), solder joint thermal stress and/or other interconnect methods.
- Responsible for supporting proposals including developing technical approaches and write-ups, generating labor and material cost estimates, generating schedules, and identifying risks, opportunities and risk mitigation strategies.
- Key member of the design team with outstanding leadership skills capable of leading multi-disciplined Integrated Product Teams (IPTs) through hardware development.
- Responsible for providing program status and generating design review material in clear and precise presentations and/or documents for review by management and customers.
- Responsible for providing technical direction of other design, assembly and test team members.
- Use engineering solid modeling tools to perform design tasks.
- Highly self-motivated with outstanding leadership and communication skills.
Basic Qualifications:
- BS Mechanical Engineering with minimum of 6 years’ experience in the design and analysis of electronic equipment.
- Ability to perform mechanical electronic packaging design of Microwave packages. Ability to work with RF/Power/Logic EEs to perform trade offs during the design phase, develop a concise set of requirements, and identify packaging alternatives which meet program requirements. Perform detail design to prove compliance with program requirements. Perform vendor identification and work with procurement to obtain compliant material. Support manufacturing and test to verify performance.
- Ability to be a key member of the design team working with Microwave, MMIC, and T/R Module vendors. The individual must be focused on meeting program commitments while advancing the state-of-the-art electronic packaging capabilities.
- Possess a strong knowledge of material properties used in packaging of advanced electronics and knowledge of advanced packaging thermal management techniques from chip to module/LRU level.
- Highly self-motivated and outstanding leadership skills with demonstrated experience leading multi-disciplined Integrated Product Teams (IPTs) through hardware development.
- Experienced presenting project status to technical management, program management and the customer.
- Experienced supporting proposals including developing technical approaches and write-ups, generating labor and material cost estimates, generating schedules, and identifying risks, opportunities and risk mitigation strategies.
- Experienced using 3D solid modeling tools (PRO-E preferred) to develop and iterate complex hardware designs.
- Experience with finite element software (ANSYS) preferred to perform thermal and stress analyses.
- Outstanding verbal and written communication skills.
- Ability to obtain & maintain a Secret Security Clearance.
Desired Skills:
MS in Mechanical Engineering
Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status. Join us at Lockheed Martin, where your mission is ours. Our customers tackle the hardest missions. Those that demand extraordinary amounts of courage, resilience and precision. They’re dangerous. Critical. Sometimes they even provide an opportunity to change the world and save lives. Those are the missions we care about.

As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories.
Experience Level: Hourly/Non-Exempt Business Unit: ESS6500 RMS Relocation Available: Possible Career Area: Mechanical Engineering Clearance Level: Secret Type: Full-Time Virtual Location: no Work Schedule: TEMPO: 9X80A - Standard Fri to Fri (Flex & Rigid) Shift: First Apply Now

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